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Lohmann Market Blog

Market Insights: Thinking Beyond the Tape

Bonding technology shapes how products are made - from the first prototype to full-scale production. In this blog, Lohmann specialists from across our market divisions share practical knowledge on adhesive bonding solutions, process integration, and the engineering decisions that go into every application. Whether you're optimising an existing assembly process or evaluating bonding for a new design, you'll find relevant perspectives here, specific, technical, and written by people who work with these challenges every day. 

One Supplier for All Your Home Appliance Bonding Needs: Adhesive Tapes and Die-Cut Solutions from a Single Source
Thickness — More Than a Number on a Datasheet: What Nominal Value and Actual Caliper Really Mean for Your Press Setup
Health Patch Development: Why Medical Wearable Developers Need a CDMO+ Partner
Smart Bonding Solutions for Cards: A CardTREX 2026 Q&A with Christoph Krämer
ECG and the Tape Beneath It: Why Extended Color Gamut Printing Demands More From Your Plate Mounting Tape
Adhesive Bonding Solutions for Solar Module Assembly: What PV Manufacturers Need to Know
Smart Card Chip Bonding: Why One Adhesive Film Beats Many
Bond Firmly. Remove Cleanly.  Residue-Free Temporary Bonding with DuploCOLL® 59330
ECG Printing: What It Is, Why It's Growing, and Where the Process Gets Demanding
Inside the Foam: How Cell Size Influences Bounce Behavior and What That Means for Your Tape Specification
All Frames. One Tape. Zero Compromise. Reliable Bonding for Modern Decorative Profiles with DuploCOLL® 50118
One Partner, Two Bonding Challenges: Lohmann's Adhesive Approach for CGM Devices and Insulin Patch Pumps

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