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Increased Efficiency in Passport Manufacturing Processes

We help passport manufacturers create secure connections between passport cover and inlay as well as inner pages, and realize new material combinations. The cover page lamination process is optimized for efficiency, eliminating the common disadvantages of liquid bonding, such as aspiration and the necessity for cleaning.

The low actiavtion temperature of our adhesive solutions (> 85°C) enables both material protection and energy savings. The product's unique adhesive design ensures immediate adhesive strength, allowing for direct processing of the material.

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Cover Page and Inlay Bonding

Our adhesive tapes include a highly flexible, thermoset adhesive layer optimized for high-speed roll-to-roll processes. This allows our customers to achieve their production goals while maintaining the highest standards of security and quality. 

The efficiency of the cover page lamination process is enhanced, while at the same time the typical disadvantages of liquid bonding are eliminated. The DuploTEC SBF range is user-friendly, roll-to-roll ready, compatible with new material combinations, and offers a high flexibility after curing as well as an outstanding durability. 

Application Brochure download

Your benefits


Efficiency

  • Immediate adhesive strength allows quick processing, storage time is no longer required
  • Shortest machine setup as no need for cleaning
  • Roll-to-roll ready
  • Easy to integrate into existing processes
  • Suitable for many material combinations, e.g. PVC, PC, PPG TESLIN®, Neobond®, PETG and paper


Security & Quality

  • High flexibility after curing

  • Outstanding durability

  • Material protection due to low adhesive activation temperature

  • Highest security and quality standards





Sustainability

  • Energy saving due to low activation temperature
  • No solvent aspiration required
  • Less material waste as potting time is no longer required






Cover-page-inlay-bonding-applications

High-Security Credential Components for Passports & ID Documents

As governments strengthen security standards for passports, ID cards and other credentials, the demand for advanced, tamper-proof components is growing. These applications require security features that are easy to verify yet impossible to replicate, and also can be integrated seamlessly into increasingly complex document designs.

At the same time, new material combinations and hybrid constructions require highly engineered bonding solutions that combine adhesives, coatings, die-cutting and application expertise. 

Application Brochure download

Your benefits


Efficiency

  • Immediate adhesive strength allows quick processing, and storage time is no longer required
  • Shortest machine setup as no need for cleaning
  • Roll-to-roll ready
  • Easy to integrate into existing processes
  • Co-creation of tailored bonding solutions, including customized adhesive formulations, geometries, and functional features - perfectly aligned with each document design and according to country-specific requirements

 

 

 


Security & Quality

  • Our engineered adhesive systems enable advanced anti-counterfeiting features including options with planned UV fluorescence for covert or overt authentication

  • Extremely thin adhesive layers (down to 5 µm and below) supporting fine structures, minimal tolerances, and modern credential designs

  • We offer digital high-precision die-cutting and converting technologies to supply sheets or ready-to-use formats that fit seamlessly into your complex document layouts

  • Strong and durable bonding on multi-layer constructions and advanced material combinations, including polycarbonate, paper, and sustainable substrates


Sustainability

  • Compatibility with recycled and bio-based materials
  • Energy saving due to low activation temperature
  • No solvent aspiration required
  • Less material waste as potting time is no longer required

 

 

 

 

 

 

ID Document Manufacturing without Compromises

At Lohmann, we strive for the perfect bonding solution for your manufacturing process without the typical disadvantages of liquid bonding, while at the same time providing high-tech adhesive tape solutions with our reliable and tamper-proof thermoset adhesive portfolio.

DuploTEC® SBF Range

With Lohmann’s state-of-the art DuploTEC SBF (Structural Bonding Films) PU portfolio, there is a wide range of adhesive thicknesses available. Additionally, the low temperature crosslinking reactive adhesive portfolio (DuploTEC SBF LTC) offers further advantages for several applications. DuploTEC SBF is easy to handle, dimensional precise and pre-applicable, and thus enables a fast and neat processing.

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Questions, Ideas, or a Need for Consulting?

Then please feel free to contact us! Our experts are here to assist you with all your inquiries.
Whether technical advice, product information, or individual solutions - we are here for you. 

 
Krämer-Christoph-1
Christoph Krämer
Senior Market Manager
Cards & Security
 
Eller-Jan-1
Jan Eller
Application Engineer
Cards & Security