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Reliable Bonding on Eco-Friendly Card Materials

Lohmann is dedicated to assisting card manufacturers in enhancing their production processes. We strive to achieve this by reducing their dependency on suppliers and increasing their output. With DuploTEC SBF we offer a solvent-free thermoset transfer film that is both user-friendly and optionally capable of electrical conductivity in the

z-direction. This film is compatible with existing equipment, offering a streamlined and cost-effective solution for card manufacturers. DuploTEC SBF allows card manufacturers to reduce their environmental impact while maintaining the production of high-quality smart cards. 

Your benefits


Efficiency

  • Easy to integrate into existing processes
  • Lower activation temperatures in comparison to traditional hotmelt tapes
  • Suitable for many material combinations - one tape for all card materials
  • High conductivity enables biometric sensor functionalities 


Quality & Security

  • High flexibility after curing

  • High and reliable conductivity in the z-direction

  • Outstanding durability

  • Material protection due to low adhesive activation temperature
    Secure and reliable connection


Sustainability

  • Very good performance on halogen-free materials (such as Parley Ocean Plastic®, rPETG and PLA) or rPVC
  • Solvent free
  • Energy saving due to low activation temperature
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Chip and Sensor Bonding

The DuploTEC SBF product range provides reliable and secure solutions for chip and sensor integration in smart card manufacturing, including payment cards, biometric sensors and Electronic Card Security Codes.

Designed for demanding applications and most card materials such as rPVC, rPETG, PLA and Ocean Plastic-based substrates, the SBF technology enables efficient production processes with low activation temperatures and high flexibility after curing. In addition, it meets Mastercard Card Quality Management (CQM) requirements and complies with all relevant ISO standards.

Application Brochure download
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To address varying application and process requirements in smart card production, DuploTEC SBF is available in two product variants:

  • A non-conductive version providing strong and reliable mechanical bonding for chip embedding and component integration.

  • An anisotropic electrically conductive version, offering secure electrical conductivity exclusively in the z-direction for reliable chip-to-antenna and sensor connections.

Both variants support the production of high-quality, durable and sustainable smart cards while helping manufacturers optimize process efficiency and product reliability.

Product Handling Manual download

Sustainable Solutions with Added Value in the Card Industry

At Lohmann, we understand the importance of reducing environmental impact. That‘s why we especially developed our products to be used with
alternative card materials such as Parley Ocean Plastic®, PLA, PC, rPVC etc..

DuploTEC® SBF Range

With Lohmann’s state-of-the art DuploTEC SBF (Structural Bonding Films) PU portfolio, there is a wide range of adhesive thicknesses available. Additionally, the low temperature crosslinking reactive adhesive portfolio (DuploTEC SBF LTC) offers further advantages for several applications. DuploTEC SBF is easy to handle, dimensionally precise and pre-applicable, and thus enables a fast and neat processing.

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Structural Bonding Films chevron_right

Questions, Ideas, or a Need for Consulting?

Then please feel free to contact us! Our experts are here to assist you with all your inquiries.
Whether technical advice, product information, or individual solutions - we are here for you. 

 
Krämer-Christoph-1
Christoph Krämer
Senior Market Manager
Cards & Security
 
Eller-Jan-1
Jan Eller
Application Engineer
Cards & Security