Smart Bonding Solutions for Smart Cards
Reliable bonding on eco-friendly card materials means innovative adhesive tapes that provide a secure and reliable connection between chip modules and antennas while reducing the environmental impact.
.svg)
Chip and Sensor
Bonding
Improving the production process with secure and reliable connections between chip modules and antennas with even more benefits as low activation temperatures, high flexibility after curing, high and reliable conductivity in the z-direction and very good performance on halogen-free materials or rPVC.
Chip Implanting
Reliable, Secure, Sustainable
With DuploTEC SBF range, we provide chip embedding solutions that enable efficient and secure production of eco-friendly payment cards, so that card manufacturers can reduce their environmental footprint while still creating high-quality smart cards.
DuploTEC® SBF Range
With Lohmann’s state-of-the art DuploTEC SBF (Structural Bonding Films) PU portfolio, there is a wide range of adhesive thicknesses available. Additionally, the low temperature crosslinking reactive adhesive portfolio (DuploTEC SBF LTC) offers further advantages for several applications. DuploTEC SBF is easy to handle, dimensional precise and pre-applicable and thus, enables a fast and neat processing.
