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Co-Creation is the Best Way to Bond

Lohmann assists manufacturers of cards and ID documents in optimizing their operations by achieving more with less. We achieve this by forming partnerships with our customers to create solutions that are beneficial to all parties.  

Our adhesive solutions encompass a wide range of products, including overlay coatings, spine tapes, hinge support, die-cuts for films and adhesives, and security features within the adhesives themselves. 

Our Smart Bonding Approach

With our Smart Bonding Approach, you gain close collaboration and consulting that can quickly turn your ideas into high-performance, forward-thinking bonding solutions. From the start, we work with you to understand your specific challenges and goals, ensuring that every solution meets your exact requirements. Backed by our technical expertise and in-depth knowledge of materials and processes, we develop customised solutions that transform innovative concepts into reliable, scalable products.

The result? Advanced security features, new functionalities and next-generation concepts for security documents. Our collaborative development approach expands the possibilities for product design and functional integration, offering greater flexibility in the construction of documents and cards. It opens the door to new material combinations and supports the development of modern hybrid card concepts, which are becoming increasingly important in the security and identification market.

Our passion for smart bonding solutions enables you to go beyond – get in touch with us to find out more!

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Innovative and
Customized Solutions for Secure Documents

Lohmann offers a wide range of adhesive solutions that can be customized for various materials according to customer requirements. We have the capability to directly equip customer-specific substrates with adhesive and convert the product in the subsequent step.

Here's a selection from our customizing capabilites:

  • Thickness range: 5μ - 300μ
  • Adhesive type: thermoset
  • Pre-lamination: 55°C
  • Activation: 70-180°C
  • Colors: translucent, UV-dull, black
  • Formats: rolls, sheets, die-cuts
  • Suitable materials: PC, synthetic materials, inlay materials, PLA, PVC, cover materials, paper, rPET-G, Parley Ocean Plastic®
  • Coating possible on the materials mentioned above

Application Flyer download

ACHIEVE

  • Chip bonding
  • Card / inlay lamination
  • Passport cover lamination

MORE

  • Efficient
  • Sustainable
  • Material combinations
  • Recycled materials
  • Security features

WITH

  • DuploTEC SBF
  • Thermoset
  • Electrical conductivity

LESS

  • Energy
  • Temperatures
  • Time
  • Risk
  • Costs

DuploTEC® SBF Range

With Lohmann’s state-of-the art DuploTEC SBF (Structural Bonding Films) PU portfolio, there is a wide range of adhesive thicknesses available. Additionally, the low temperature crosslinking reactive adhesive portfolio (DuploTEC SBF LTC) offers further advantages for several applications. DuploTEC SBF is easy to handle, dimensionally precise and pre-applicable, and thus enables a fast and neat processing.

 

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Structural Bonding Films chevron_right

Questions, Ideas, or a Need for Consulting?

Then please feel free to contact us! Our experts are here to assist you with all your inquiries.
Whether technical advice, product information, or individual solutions - we are here for you. 

 
Krämer-Christoph-1
Christoph Krämer
Senior Market Manager
Cards & Security
 
Eller-Jan-1
Jan Eller
Application Engineer
Cards & Security